Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2011-02-01
2011-02-01
Loke, Steven (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S578000
Reexamination Certificate
active
07880288
ABSTRACT:
A semiconductor module has at least two semiconductor chips (4, 5) with at least one first and one second electrode (12, 13) on their first sides. Each semiconductor chip (4, 5) has a third electrode (14) on its second side (16). A chip arrangement within the semiconductor module (1) is provided such that the electrodes (12, 13) on the first sides of the semiconductor chips (4, 5) are oriented toward a second side of the semiconductor module (1) and the third electrodes (14) on the second sides (16) of the semiconductor chips (4, 5) are oriented toward a first side of the semiconductor module (1). For this purpose, external terminals (19, 20) on the second side of the semiconductor module (1) are directly coupled to the electrodes (12, 13) of the first sides and connecting elements (22) electrically couple the third electrodes (14) to corresponding external terminals (21).
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Banner & Witcoff , Ltd.
Infineon - Technologies AG
Loke Steven
Thomas Kimberly M
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