Semiconductor module with scalable construction

Details Semiconductor module with scalable construction Semiconductor module with scalable construction

2007-01-16

2007-01-16

Ho, Tu-Tu (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S684000, C257S690000, C257SE25030

Reexamination Certificate

active

10897720

ABSTRACT:
A power semiconductor module with a scalable construction, having a base plate or intended for direct mounting on a heat sink. The module has a framelike housing, a cover, terminal elements, extending to the outside of the housing for load contacts and auxiliary contacts. The module having at least two electrically insulating substrates disposed inside the housing, which in turn each comprise one insulating body and a plurality of metal conducting tracks, located on the first main face of the insulating body, which first main face is remote from the base plate or the heat sink. The metal connecting tracks are electrically insulated from one another, and power semiconductor components are located on and electrically connected to these connecting tracks. The substrates (50) are identical, and electrically connected to one another, and have the same type and number of power semiconductor components disposed thereon.

REFERENCES:
patent: 6835994 (2004-12-01), Kistner et al.
patent: 103 16 355 (2004-07-01), None

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