Semiconductor module with an improved heat sink/insulation plate

Details Semiconductor module with an improved heat sink/insulation plate Semiconductor module with an improved heat sink/insulation plate

1995-05-18

1996-12-17

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257724, 257706, H01L 2310, H01L 2334

Patent

active

055856721

ABSTRACT:
A semiconductor module having heat sink plates and an insulating plate laminated under the semiconductor chips, wherein the thickness of the support base plate is set to be 2.5 times in thickness of the insulating plate, which is the maximum thickness among the heat sink plates and the insulating plate laminated in the semiconductor module, so that the thermal fatigue lives of the solder layers are balanced, and the life of the whole semiconductor module can be prolonged.

REFERENCES:
patent: 4556899 (1985-12-01), Kurihara et al.
patent: 4620215 (1986-10-01), Lee
patent: 5291065 (1994-03-01), Arai et al.
patent: 5446318 (1995-08-01), Koike et al.

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