Semiconductor module with a plurality of power devices mounted o

Details Semiconductor module with a plurality of power devices mounted o Semiconductor module with a plurality of power devices mounted o

1993-09-01

1995-08-29

Wojciechovicz, Edward

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257724, H01L 2302

Patent

active

054463181

ABSTRACT:
A semiconductor module having heat sink plates and an insulating plate laminated under the semiconductor chips, wherein the thickness of the support base plate is set to be 2.5 times in thickness of the insulating plate, which is the maximum thickness among the heat sink plates and the insulating plate laminated in the semiconductor module, so that the thermal fatigue lives of the solder layers are balanced, and the life of the whole semiconductor module can be prolonged.

REFERENCES:
patent: 4556899 (1985-12-01), Kurihara et al.
patent: 5291065 (1994-03-01), Arai et al.

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