Semiconductor module with a dielectric layer including a...

Details Semiconductor module with a dielectric layer including a... Semiconductor module with a dielectric layer including a...

2011-05-31

2011-05-31

Chambliss, Alonzo (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S759000, C438S623000

Reexamination Certificate

active

07952188

ABSTRACT:
A module is described having a semiconductor chip which has at least one contact pad. A first dielectric layer, which contains a fluorocarbon compound, as well as a first wiring layer are applied to the semiconductor chip.

REFERENCES:
patent: 5798563 (1998-08-01), Feilchenfeld et al.
patent: 6028364 (2000-02-01), Ogino et al.
patent: 6391422 (2002-05-01), Mori et al.
patent: 6756662 (2004-06-01), Infantolino et al.
patent: 6773958 (2004-08-01), Wang
patent: 6967389 (2005-11-01), Infantolino et al.
patent: 2002/0088707 (2002-07-01), Towle
patent: 2003/0113995 (2003-06-01), Xia et al.
patent: 2003/0155145 (2003-08-01), Ou et al.
patent: 2004/0058474 (2004-03-01), Infantolino et al.
patent: 2005/0266668 (2005-12-01), Sawada et al.
patent: 2006/0087037 (2006-04-01), Hsu
patent: 2007/0048903 (2007-03-01), Komiyama et al.
patent: 2008/0142963 (2008-06-01), Venegas et al.
patent: 203 03 492 (2003-05-01), None
patent: 101 57 280 (2003-06-01), None
patent: 102 53 855 (2004-06-01), None
Brunnbauer et al., “Embedded Wafer Level Ball Grid Array (eWLB),” 2006 Electronics Packaging Technology Conference, pp. 1-5.

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