Electric power conversion systems – Current conversion – With conductive support mounting
Patent
2000-02-17
2000-11-07
Han, Jessica
Electric power conversion systems
Current conversion
With conductive support mounting
363147, 257687, H03M 700, H01L 23043
Patent
active
061445711
ABSTRACT:
In order to bring a moduled power converter into less size and cost in the case of a structure having a lead-insert-case, an insulated metal circuit board and a printed circuit board, a difficulty was encountered in thinning a wiring width and an increase in pad area for each metal wire has interfered with a reduction in its size and cost.
In the present invention to cope with it, a power converter is constructed by using a semiconductor module having such a structure that a metal base and lead frames are adhered to each other in a state in which an insulating adhesive sheet is interposed therebetween, a resin-molded outer package is adhered to the metal base with an adhesive or the like, and a resin sealing agent is charged into the resin-molded outer package to thereby integrally seal the resin-molded outer package and circuit parts such as semiconductor elements implemented therein, whereby a reduction in size and cost thereof is realized.
REFERENCES:
patent: 5604674 (1997-02-01), Terasawa
patent: 5747875 (1998-05-01), Oshima
patent: 5804952 (1998-09-01), Chen
Fujii Hiroshi
Maeno Yutaka
Nakatsu Kinya
Ogawa Toshio
Sasaki Yasushi
Han Jessica
Hitachi , Ltd.
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