Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-07-27
2011-11-29
Chen, Xiaoliang (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S709000, C361S718000, C361S752000, C361S760000, C174S250000, C174S252000, C257S079000, C257S089000, C257S355000, C257S690000, C257S758000, C257S777000, C438S107000, C438S618000
Reexamination Certificate
active
08068343
ABSTRACT:
A semiconductor module is provided, which is capable of suppressing the deterioration of reliability and improving heat radiation. The semiconductor module includes: a semiconductor substrate in which electrodes of a circuit element are formed on its surface; a re-wiring pattern connected to the electrodes to ensure large pitch of the electrodes; an electrode integrally formed with the re-wiring pattern; an insulating layer formed on a rear surface of the semiconductor substrate; a radiator formed on the insulating layer; and projections integrally formed with the radiator and penetrating the insulating layer to connect to the rear surface of the semiconductor substrate.
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Inoue Yasunori
Nagamatsu Masayuki
Usui Ryosuke
Chen Xiaoliang
Fish & Richardson P.C.
Sanyo Electric Co,. Ltd.
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