Semiconductor module mounting structure, a cardlike...

Details Semiconductor module mounting structure, a cardlike... Semiconductor module mounting structure, a cardlike...

2007-07-10

2007-07-10

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S707000, C257S706000, C257S707000, C257S712000, C257S787000, C257S788000

Reexamination Certificate

active

11105449

ABSTRACT:
A semiconductor module has metallic radiator plates provided at central regions of principal surfaces of a sealing resin so as to expose from these principal surfaces. The metallic radiator plates and the principal surfaces of the sealing resin are bonded via grease gaps to heat receiving members. The grease gaps are widened in outer regions far from the metallic radiator plates compared with inner regions adjacent to the metallic radiator plates, to prevent external air from entering into the grease gaps even when the semiconductor module causes repetitive thermal expansions and contractions.

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