Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2008-01-30
2010-12-21
Tran, Long K (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S750000, C257S774000, C257S781000, C257S785000, C257SE23020, C257SE23068, C257SE23070
Reexamination Certificate
active
07855452
ABSTRACT:
An electrode for a semiconductor device is formed on the mounting surface (particularly, the outer periphery thereof) of a semiconductor substrate in a semiconductor module. In order to secure a large gap between the electrodes, an insulating layer is formed on the electrode. Also formed are a plurality of bumps penetrating the insulating layer and connected to the electrode, and a rewiring pattern integrally formed with the bumps. The rewiring pattern includes a bump area and a wiring area extending contiguously with the bump area.The insulating layer is formed to have a concave upper surface in an interval between the bumps, and the wiring area of the rewiring pattern is formed to fit that upper surface. The wiring area of the rewiring pattern is formed to be depressed toward the semiconductor substrate in relation to the bump area of the rewiring pattern.
REFERENCES:
patent: 2002/0132461 (2002-09-01), Kizaki
patent: 2003/0102551 (2003-06-01), Kikuchi
patent: 2004/0140561 (2004-07-01), Suzuki
patent: 09-289264 (1997-11-01), None
Inoue Yasunori
Mizuhara Hideki
Okayama Yoshio
Shibata Kiyoshi
Usui Ryosuke
Fish & Richardson P.C.
Sanyo Electric Co,. Ltd.
Tran Long K
LandOfFree
Semiconductor module, method of manufacturing semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor module, method of manufacturing semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor module, method of manufacturing semiconductor... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4169401