Semiconductor module including components in plastic casing

Details Semiconductor module including components in plastic casing Semiconductor module including components in plastic casing

2011-01-04

2011-01-04

Mandala, Victor A (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S687000, C257S706000, C257SE23129, C257SE23063, C257SE23080

Reexamination Certificate

active

07863728

ABSTRACT:
A semiconductor module includes components in a plastic casing. The semiconductor module includes a plastic package molding compound and a semiconductor chip. Also provided in the module are a first principal surface including an upper side of the plastic package molding compound and at least one active upper side of the semiconductor chip, a second principal surface including a back side of the plastic package molding compound, and a multilayered conductor track structure disposed on the first principal surface and a second metal layer disposed on the second principal surface.

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