Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2006-03-09
2009-11-24
Tran, Minh-Loan T (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S787000, C257SE23116
Reexamination Certificate
active
07622805
ABSTRACT:
Multiple semiconductor device components and passive device components fixed to a substrate are embedded within an electroconductive-film/insulating-resin-film structure, and are thermally bonded to an insulating resin film.
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Taiwanese Office Action Issued in Taiwan Patent Application No. 93127258, dated Mar. 21, 2007.
Korean Office Action issued in Korean Patent Application No. 10-2006-7004737, dated Mar. 26, 2007.
Korean Office Action, with English translation, issued in Korean Patent Application No. KR 10-2006-7004737, mailed Jan. 21, 2008.
Korean Office Action issued in Korean Patent Application No. KR 10-2006-7004737 dated on Apr. 1, 2008.
Chinese Office Action issued in Patent Application No. 200480030531.X dated on Jun. 6, 2008.
Inoue Yasunori
Usui Ryosuke
Kuo W. Wendy
McDermott Will & Emery LLP
Sanyo Electric Co,. Ltd.
Tran Minh-Loan T
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