Semiconductor module having inner pressure release portion

Details Semiconductor module having inner pressure release portion Semiconductor module having inner pressure release portion

2007-03-13

2007-03-13

Doan, Theresa T. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000, C257S707000

Reexamination Certificate

active

10778029

ABSTRACT:
A semiconductor module includes a semiconductor chip having a first surface and a second surface; a first electrode plate contacting the first surface of the semiconductor chip; a second electrode plate contacting the second surface of the semiconductor chip; and a resin mold for sealing the first and second electrode plates and the semiconductor chip. The resin mold includes an inner pressure release portion for releasing a pressure in the resin mold.

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