Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2011-04-12
2011-04-12
Smith, Zandra (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257SE23031, C257SE23037, C257SE23043, C257SE21499, C438S123000
Reexamination Certificate
active
07923827
ABSTRACT:
Semiconductor module for a Switched-Mode Power Supply comprises at least one semiconductor power switch, a control semiconductor chip and a leadframe comprising a die pad and a plurality of leads disposed on one side of the die pad. The die pad comprises at least two mechanically isolated regions wherein the semiconductor power switch is mounted on a first region of the die pad and the control semiconductor chip is mounted on a second region of the die pad. Plastic housing material electrically isolates the first region and the second region of the die pad and electrically isolates the semiconductor power switch from the control semiconductor chip.
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Deml Gerhard
Heng Yang Hong
Lee Kean Cheong
Otremba Ralf
Schloegel Xaver
Dicke, Billig & Czaja P.L.L.C.
Infineon - Technologies AG
Joy Jeremy J
Smith Zandra
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