Semiconductor module, electronic device and electronic...

Details Semiconductor module, electronic device and electronic... Semiconductor module, electronic device and electronic...

2007-04-24

2007-04-24

Parker, Kenneth (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S784000, C257S672000, C257S676000, C257S690000, C257S689000, C257S797000, C257S674000, C257SE23179

Reexamination Certificate

active

10863808

ABSTRACT:
First alignment marks are provided on a film substrate in a manner that they are located at positions offset from the disposed positions of second alignment marks provided on a semiconductor chip. The amount of expansion or contraction of the film substrate is obtained by measuring the distance between the first alignment marks. Based on the amount of expansion or contraction, the semiconductor chip is shifted with respect to the film substrate and mounted thereon.

REFERENCES:
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patent: 6897567 (2005-05-01), Horie
patent: 2003/0147580 (2003-08-01), Worley
patent: 2005/0012224 (2005-01-01), Yuzawa
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Examination result issued in corresponding Japanese application.

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