Semiconductor module and semiconductor device

Details Semiconductor module and semiconductor device Semiconductor module and semiconductor device

2006-03-07

2006-03-07

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S723000

Reexamination Certificate

active

07009291

ABSTRACT:
In a semiconductor device, a semiconductor module contains a semiconductor element and having a radiating portion, and a heat absorbing member has a heat absorbing portion with heat conductivity. A grease member is interposed between the radiating portion of the semiconductor module and the heat absorbing portion of the heat absorbing member. The radiating portion and absorbing portion are opposite and close to each other through the grease member in a predetermined direction. A grease extrusion path has one end and other end portions and formed in at least one of the radiating portion and the heat absorbing portion. The one end portion of the grease extrusion path is configured to contact the grease member, said other end portion thereof communicates with an exterior of the at least one of the radiating portion and the heat absorbing portion.

REFERENCES:
patent: 5094769 (1992-03-01), Anderson et al.
patent: 6037658 (2000-03-01), Brodsky et al.
patent: 6542365 (2003-04-01), Inoue
patent: A 2001-308263 (2001-11-01), None

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