Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-11-02
2009-08-04
Nguyen, Cuong Q (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S717000
Reexamination Certificate
active
07569930
ABSTRACT:
A semiconductor module10in which respective upper surfaces of semiconductor elements17, 17on both sides of a rectangular circuit board11are covered with radiator plates12a, 12battached to both sides of the circuit board11so that their outer peripheral edges are not projected from the board surfaces of the circuit board11. In this semiconductor module, by projections serving as a pair of attachments42, 42formed in the vicinity of the center area in a longitudinal direction of the circuit board11, the radiator plates12a, 12bare located at predetermined positions. The projections abuts on the corresponding board surface of the circuit board11so that a part of the load applied to the vicinity of the center area of each the radiator plates12a, 12bcan be supported by the circuit board11.
REFERENCES:
patent: 5767576 (1998-06-01), Kobayashi et al.
patent: 2006/0060982 (2006-03-01), Ikawa et al.
patent: 2006/0113661 (2006-06-01), Yamabuchi et al.
patent: 2001-196516 (2001-07-01), None
Aoki Shuzo
Uehara Sumio
Nguyen Cuong Q
Rankin , Hill & Clark LLP
Shinko Electric Industries Co. Ltd.
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