Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Reexamination Certificate
2006-11-14
2006-11-14
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With heat sink embedded in encapsulant
C257S707000, C257S784000, C257S692000, C257S698000
Reexamination Certificate
active
07135782
ABSTRACT:
A semiconductor module includes: a printed wiring board made of an insulator with conductor patterns formed on both sides thereof. An IC chip is mounted on the printed wiring board and sealed with a resin. A metallic sheet or moisture penetration blocking sheet is adhered on the IC chip surface opposite to the side that faces the printed wiring board.
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Nixon & Vanderhye P.C.
Parekh Nitin
Sharp Kabushiki Kaisha
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