Semiconductor module and power conversion device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads

Reexamination Certificate

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Details

C257S736000

Reexamination Certificate

active

06873045

ABSTRACT:
One method of achieving the above subjects is by connecting one of electroconductive members12, which are pre-connected to the top and bottom of a semiconductor chip11and have thermal conductivity, to an electroconductive member13, which is used with the semiconductor chip11to constitute a laminated structure, in electrically insulated form on the same surface as the installation surface of the electroconductive member13so as to straddle the laminated structure constituted by the semiconductor chip11and the electroconductive member13.

REFERENCES:
patent: 5218231 (1993-06-01), Kudo
patent: 6072240 (2000-06-01), Kimura et al.
patent: 6396127 (2002-05-01), Munoz et al.
patent: 6479888 (2002-11-01), Hirashima et al.
patent: 6521982 (2003-02-01), Crowley et al.
patent: 6528880 (2003-03-01), Planey
patent: 6697257 (2004-02-01), Wolf et al.
patent: 20010050421 (2001-12-01), Kono
patent: 20020005272 (2002-01-01), Hirano et al.
patent: 19950026 (2001-04-01), None
patent: 0361495 (1990-04-01), None
patent: 1014451 (2000-06-01), None
patent: 1111677 (2001-06-01), None
patent: 2786657 (2000-06-01), None
patent: 10-056131 (1998-02-01), None

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