Semiconductor module and method of forming a semiconductor...

Details Semiconductor module and method of forming a semiconductor... Semiconductor module and method of forming a semiconductor...

2007-05-08

2007-05-08

Tran, Minhloan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S723000, C257S738000, C257S778000, C257S780000, C257S786000, C257SE23010, C257S025000

Reexamination Certificate

active

11246303

ABSTRACT:
In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.

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patent: 2001-94244 (2001-04-01), None

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