Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2008-03-27
2010-12-28
Mandala, Victor A (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257SE23088, C257SE23186, C363S141000, C361S699000
Reexamination Certificate
active
07859103
ABSTRACT:
A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate.
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International Search Report mailed Apr. 1, 2008 for PCT/JP2008/052539.
Aoki Kazuo
Tsuruoka Junji
Yasui Seiji
Aisin AW Co. Ltd.
Mandala Victor A
Moore Whitney
Oliff & Berridg,e PLC
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