Semiconductor module and inverter device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

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Details

C257SE23088, C257SE23186, C363S141000, C361S699000

Reexamination Certificate

active

07859103

ABSTRACT:
A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate.

REFERENCES:
patent: 5966291 (1999-10-01), Bäumel et al.
patent: 6888729 (2005-05-01), Maekawa et al.
patent: 6978856 (2005-12-01), Nakamura et al.
patent: 2001/0014029 (2001-08-01), Suzuki et al.
patent: A 10-178151 (1998-06-01), None
patent: A 2001-308246 (2001-11-01), None
patent: A 2001-339020 (2001-12-01), None
patent: A 2004-103936 (2004-04-01), None
patent: A-2004-349324 (2004-12-01), None
patent: A 2005-191502 (2005-07-01), None
International Search Report mailed Apr. 1, 2008 for PCT/JP2008/052539.

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