Semiconductor module and cooling device of the same

Details Semiconductor module and cooling device of the same Semiconductor module and cooling device of the same

1988-10-17

1991-02-26

Wojciechowicz, Edward J.

357 79, 357 81, H01L 2504

Patent

active

049965891

ABSTRACT:
A number of LSI chips (9) are mounted on a wiring substrate (12). A cooling element (68) comprises a housing (1), a bellows (2) and a cooling plate (6) for introducing a cooling medium. The cooling element is connected to the LSI chip by low melting solder, at the same time, the cooling plate is connected to the wiring substrate through a skirt (5) which is connected to the cooling plate and also connected to the wiring substrate by a low melting solder.

REFERENCES:
patent: 4729060 (1988-03-01), Yamamoto et al.
IBM-Tech. Dis. Bul.-Clark-vol. 19, No. 4, Sep. 1976, p. 1336.

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