Semiconductor module and an electronic computer using the semico

Heat exchange – With valve or movable deflector for heat exchange fluid flow – With by-pass of heat exchanger or heat exchanger section

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165 805, 1651341, H01L 2344, H01L 2336

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active

049774433

ABSTRACT:
A semiconductor module comprises semiconductor elements, cooling structures for cooling the semiconductor elements by liquid refrigerant, and a housing for accommodating the semiconductor elements and the cooling structures, wherein within the housing, there is supplied or enclosed sealingly a reactive gas which reacts with ions of a metal constituting the cooling structures to form a chemical compound hard to dissolve to the refrigerant but does not react with the metal itself constituting the cooling structures.

REFERENCES:
patent: 3947610 (1976-03-01), Bodmer et al.
patent: 4487707 (1984-12-01), Hokzknecht
patent: 4698728 (1987-10-01), Tustaniwskyj et al.
Metals Handbook-Ninth Edition-vol. 13, "Corrosion", ASM International-pp. 754-769.
"Protection System for a Liquid Cooled Computer System Using a Shell and Tube Heat Exchanger"-IBM Technical Disclosure Bulletin-vol. 25, No. 7B, Dec. 1982, pp. 3909-3910.

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