Semiconductor module

Details Semiconductor module Semiconductor module

2009-03-12

2011-10-04

Pham, Hoai V (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S110000, C257SE21499

Reexamination Certificate

active

08030131

ABSTRACT:
A module having a semiconductor chip with a first contact element on a first main surface and a second contact element on a second main surface is disclosed. The semiconductor chip is arranged on a carrier. An insulating layer and a wiring layer cover the second main surface and the carrier.

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