Semiconductor module

Details Semiconductor module Semiconductor module

2004-12-20

2010-06-15

Ngo, Hung V (Department: 2831)

Electricity: conductors and insulators

Anti-inductive structures

Shielded

C174S377000, C257S098000, C257S659000

Reexamination Certificate

active

07737369

ABSTRACT:
A semiconductor module (A1) comprises a semiconductor device (10) provided with a semiconductor chip, and a conductive cover (6) for electromagnetic shielding bonded to the semiconductor device (10) via an adhesive coat (8). The conductive cover (6) includes a surface facing the adhesive coat (8), and the surface is formed with a convex portion (6a) protruding toward the adhesive coat (8). Around the convex portion (6a), a space (7) is formed for filling in adhesive to form the adhesive coat (8).

REFERENCES:
patent: 5118924 (1992-06-01), Mehra et al.
patent: 5355016 (1994-10-01), Swirbel et al.
patent: 5406117 (1995-04-01), Dlugokecki et al.
patent: 5485037 (1996-01-01), Marrs
patent: 5557142 (1996-09-01), Gilmore et al.
patent: 5559306 (1996-09-01), Mahulikar
patent: 5594204 (1997-01-01), Taylor et al.
patent: 5679975 (1997-10-01), Wyland et al.
patent: 5825042 (1998-10-01), Strobel et al.
patent: 6590152 (2003-07-01), Horio et al.
patent: 2002/0094177 (2002-07-01), Horio
patent: 8-167724 (1996-06-01), None
patent: 11-126913 (1999-05-01), None
patent: 2001-68722 (2001-03-01), None
patent: 2001-135859 (2001-05-01), None
patent: 2002-76427 (2002-03-01), None
patent: 2002-185022 (2002-06-01), None

Affiliated with

Also associated with

Rating

Semiconductor module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4217164