Semiconductor module

Details Semiconductor module Semiconductor module

2007-12-13

2009-11-24

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S778000

Reexamination Certificate

active

07622812

ABSTRACT:
A semiconductor module includes a semiconductor chip sealed with an encapsulation resin prevented from overflowing from an inside of the outer edge by a wiring pattern extended portion extending from the wiring pattern along an outer edge of a solder resist pattern at an outside of the outer edge of the solder resist pattern.

REFERENCES:
patent: 6101098 (2000-08-01), Noda
patent: 6710458 (2004-03-01), Seko
patent: 6853089 (2005-02-01), Ujiie et al.
patent: 6998532 (2006-02-01), Kawamoto et al.
patent: 7149091 (2006-12-01), Ochi et al.
patent: 2003/0052419 (2003-03-01), Ujiie et al.
patent: 11-135685 (1999-05-01), None
patent: 2004-327851 (2004-11-01), None

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