Semiconductor module

Details Semiconductor module Semiconductor module

1986-07-03

1988-05-31

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165 803, 165185, 174 16HS, 357 81, H05K 720

Patent

active

047485388

ABSTRACT:
A semiconductor module includes a multi-layer wiring substrate provided at a first surface with a plurality of input/output terminals and at a second surface with lead terminals connected to the input/output terminals. A cap is provided above the multi-layer wiring substrate by means of leg members which forms a space between the cap and the multi-layer wiring substrate. A semiconductor chip is fixed to the side exposed to the space of the cap, and lead wires are provided, each having one end attached to a terminal of the semiconductor chip. The lead wires are drawn out in advance so that they can be visually confirmed from an upper direction of the cap and have their other ends connected to the lead terminals.

REFERENCES:
Balderes et al., "Universal Air-Cooled Module", IBM Technical Disclosure Bulletin, vol. 21, No. 11, 4/79, p. 4476.
Betz, "Circuit Module Thermal Conduction", IBM Technical Disclosure Bulletin, vol. 12, No. 8, 1/70, p. 1277.
35th Electronic Components Conference Proceedings 1985, pp. 180-186, 192-198, ISSN 0569-5503.

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