Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2007-07-16
2009-12-15
Kebede, Brook (Department: 2894)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257SE33075
Reexamination Certificate
active
07633153
ABSTRACT:
A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.
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Email dated May 24, 2008, from Elson Silva to Corwin Umbach requesting that Corwin Umbach file an IDS citing AA, AB and AC.
Arai Haruki
Endo Yoshiki
Kawaguchi Yusuke
Kawano Tomohiro
Koyanagawa Takashi
Kabushiki Kaisha Toshiba
Kebede Brook
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Tran Tony
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