Semiconductor module

Details Semiconductor module Semiconductor module

2007-11-27

2007-11-27

Dinh, Tuan T. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S784000, C361S803000

Reexamination Certificate

active

11585159

ABSTRACT:
The present invention realizes strengthening of a ground of a lower-surface ground electrode of an upper semiconductor chip and miniaturization in a semiconductor module on which two semiconductor chips are mounted in a stacked manner. A lower semiconductor chip is fixed to a bottom of a recess formed in an upper surface of a module board, and an upper semiconductor chip is fixed to an upper surface of a support body made of conductor which is formed over the upper surface of the module board around the recess. External electrode terminals and a heat radiation pad are formed over a lower surface of the module board.

REFERENCES:
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patent: 5866952 (1999-02-01), Wojnarowski et al.
patent: 5931833 (1999-08-01), Silverstein
patent: 5939783 (1999-08-01), Laine et al.
patent: 6583512 (2003-06-01), Nakaoka et al.
patent: 6741125 (2004-05-01), Arai et al.
patent: 2000-58741 (2000-02-01), None
patent: 2001-110986 (2001-04-01), None

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