Semiconductor module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07122889

ABSTRACT:
The semiconductor module includes a substrate, at least one semiconductor, and electrical contacts. The substrate includes a base layer having a substantially planar base layer first surface opposing a substantially planar base layer second surface. The base layer first surface is exposed to atmosphere and where the base layer is electrically conductive. The substrate also includes an insulator layer having a substantially planar insulator layer first surface opposing a substantially planar insulator layer second surface. The base layer second surface and the insulator layer first surface are adjacent and contiguous to one another and where the insulator layer is electrically non-conductive. Finally, the substrate includes a conductive layer having a substantially planar conductive layer first surface opposing a substantially planar conductive layer second surface. The insulator layer second surface and the conductive layer first surface are adjacent and contiguous to one another and where the conductive layer is electrically conductive.

REFERENCES:
patent: 3868724 (1975-02-01), Perrino
patent: 4879588 (1989-11-01), Ohtsuka et al.
patent: 5224023 (1993-06-01), Smith et al.
patent: 5229916 (1993-07-01), Frankeny et al.
patent: 5518964 (1996-05-01), DiStefano et al.
patent: 5550406 (1996-08-01), Mccormick
patent: 5703436 (1997-12-01), Forrest et al.
patent: 5751553 (1998-05-01), Clayton
patent: 5763952 (1998-06-01), Lynch et al.
patent: 5777345 (1998-07-01), Loder et al.
patent: 5804004 (1998-09-01), Tuckerman et al.
patent: 5925934 (1999-07-01), Lim
patent: 5926951 (1999-07-01), Khandros et al.
patent: 5936850 (1999-08-01), Takahashi et al.
patent: 5949657 (1999-09-01), Karabatsos
patent: 5998864 (1999-12-01), Khandros et al.
patent: 6002589 (1999-12-01), Perino et al.
patent: 6005778 (1999-12-01), Spielberger et al.
patent: 6023103 (2000-02-01), Chang et al.
patent: 6034878 (2000-03-01), Osaka et al.
patent: 6072700 (2000-06-01), Nam
patent: 6093969 (2000-07-01), Lin
patent: 6133629 (2000-10-01), Han et al.
patent: 6180881 (2001-01-01), Isaak
patent: 6181002 (2001-01-01), Juso et al.
patent: 6184587 (2001-02-01), Khandros et al.
patent: 6215182 (2001-04-01), Ozawa et al.
patent: 6229217 (2001-05-01), Fukui et al.
patent: 6376904 (2002-04-01), Haba et al.
patent: 6449159 (2002-09-01), Haba
patent: 6514794 (2003-02-01), Haba et al.
patent: 6520789 (2003-02-01), Daugherty, Jr. et al.
patent: 6532157 (2003-03-01), Glenn et al.
patent: 6618938 (2003-09-01), Alagaratnam et al.
patent: 6721189 (2004-04-01), Haba
U.S. Appl. No. 10/071,298, filed Feb. 7, 2002, Haba.
U.S. Appl. No. 10/087,395, filed Mar. 1, 2002, Haba.
U.S. Appl. No. 09/531,124, filed Mar. 17, 2000, Haba.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor module will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3691711

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.