Semiconductor module

Details Semiconductor module Semiconductor module

2006-02-21

2006-02-21

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Outside periphery of package having specified shape or...

C257S738000, C257S780000

Reexamination Certificate

active

07002250

ABSTRACT:
A semiconductor module, comprising a wiring substrate on which wiring is formed, a semiconductor device electrically connected to the wiring formed on the wiring substrate, and an external connection terminal arranged on the semiconductor device mounted side of the wiring substrate so as to be a connected portion between the wiring and the outside electrically connected thereto, wherein there is formed an insulating resin layer thicker than the semiconductor device between the wiring substrate and the external connection terminal.

REFERENCES:
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patent: 6320753 (2001-11-01), Launay
patent: 6324067 (2001-11-01), Nishiyama
patent: 6436733 (2002-08-01), Yukawa
patent: 2003/0127737 (2003-07-01), Takahashi
patent: 2000-31207 (2000-01-01), None
patent: 2001-339097 (2001-12-01), None
patent: 1998-025624 (1998-07-01), None

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