Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate
2011-03-08
2011-03-08
Bryant, Kiesha R (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
C257S700000, C257S732000, C257S733000, C257SE23116
Reexamination Certificate
active
07902653
ABSTRACT:
A semiconductor module includes a first metal foil; an insulating sheet mounted on a top surface of the first metal foil; at least one second metal foil mounted on a top surface of the insulating sheet; at least one semiconductor device mounted on the second metal foil; and a resin case for surrounding the first metal foil, insulating sheet, second metal foil, and semiconductor device. A bottom end of a peripheral wall of the resin case is located above a bottom surface of the first metal foil. A resin is provided inside the resin case to fill the inside of the resin case. The bottom surface of the first metal foil and the resin form a flat bottom surface so that the flat bottom surface contacts an external mounting member.
REFERENCES:
patent: 2001/0002051 (2001-05-01), Matsumoto
patent: 2003/0094682 (2003-05-01), Shinohara et al.
patent: 2003-289130 (2003-10-01), None
Small-Pack and Small-PIM IGBT Modules; Kousuke Komatsu et al; Fuji Electric Journal vol. 78, No. 4, p. 260-263 (2005).
Horio Masafumi
Maruyama Rikihiro
Mochizuki Eiji
Nishizawa Tatsuo
Bryant Kiesha R
Fuji Electric Systems Co., Ltd.
Kanesaka Manabu
Yang Minchul
LandOfFree
Semiconductor module does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor module will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2721454