Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Patent
1994-11-08
1996-04-16
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
257707, 257709, 257717, H01L 2304, H01L 2310, H01L 23043, H01L 2334
Patent
active
055085601
ABSTRACT:
A semiconductor module includes a metal base plate having a plane upper sace and a convex lower surface. An electrically insulating and thermally conductive substrate is material-lockingly connected to the upper surface of the metal base plate. Semiconductor chips are material-lockingly connected to an upper surface of the substrate.
REFERENCES:
Patent Abstract of Japan No. JP 53-017072 (Takeshi et al), Apr. 17, 1978.
Patent Abstract of Japan No. JP 56-165329 (Tomohiko) Apr. 7, 1982.
Koehler Werner
Spanke Reinhold
Clark Jhihan
Crane Sara W.
Eupec Europaeische Gesellschaft Fuer Leistungs-Halbletter mbh &
Greenberg Laurence A.
Lerner Herbert L.
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