Semiconductor microphone unit

Details Semiconductor microphone unit Semiconductor microphone unit

2007-08-31

2009-08-25

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S419000

Reexamination Certificate

active

07579678

ABSTRACT:
A semiconductor microphone unit includes a semiconductor microphone chip having a diaphragm covering an inner hole of a support. The support is adhered onto the surface of a support substrate whose thermal expansion coefficient higher than the thermal expansion coefficient of the support via a thermosetting adhesive in such a way that the diaphragm is positioned opposite to the surface of the support substrate. The thermosetting adhesive has a tensile elastic modulus allowing a contraction of the support substrate to be transmitted to the support in a hardened state when the semiconductor microphone chip is cooled together with the support substrate. Thus, it is possible to reduce the tensile stress of the diaphragm, which occurs during the manufacturing of the semiconductor microphone chip, thus preventing the diaphragm from being unexpectedly reduced in strength; hence, it is possible to improve the sensitivity of the semiconductor microphone chip.

REFERENCES:
patent: 5856914 (1999-01-01), O'Boyle
patent: 7166910 (2007-01-01), Minervini
patent: 7386136 (2008-06-01), Ohbayashi et al.
patent: 2003-508997 (2003-03-01), None
patent: 2004-537182 (2004-12-01), None

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