Semiconductor device manufacturing: process – Making passive device – Trench capacitor
Reexamination Certificate
2005-08-16
2005-08-16
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Making passive device
Trench capacitor
C257S301000, C257S347000, C438S241000, C438S246000
Reexamination Certificate
active
06930012
ABSTRACT:
A semiconductor memory device includes first and second semiconductor layers, a buried insulating layer, a trench comprising a retreated portion, and the trench defining a first opening width at the second semiconductor layer, a first capacitor electrode formed in the first semiconductor layer, a capacitor insulating film formed in the trench, a second capacitor electrode formed in the trench in the first semiconductor layer, an insulating film formed on a side surface of the retreated portion and defining second and third opening widths, the second opening width serving as a width at the buried insulating layer and being not more than the first opening width, and the third opening width serving as a width at a boundary portion between the buried insulating layer and first semiconductor layer, and a connection portion electrically connected to the second capacitor electrode.
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Nelms David
Nguyen Dao H.
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