Semiconductor memory with trench capacitor and method of...

Semiconductor device manufacturing: process – Making passive device – Trench capacitor

Reexamination Certificate

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C257S301000, C257S347000, C438S241000, C438S246000

Reexamination Certificate

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06930012

ABSTRACT:
A semiconductor memory device includes first and second semiconductor layers, a buried insulating layer, a trench comprising a retreated portion, and the trench defining a first opening width at the second semiconductor layer, a first capacitor electrode formed in the first semiconductor layer, a capacitor insulating film formed in the trench, a second capacitor electrode formed in the trench in the first semiconductor layer, an insulating film formed on a side surface of the retreated portion and defining second and third opening widths, the second opening width serving as a width at the buried insulating layer and being not more than the first opening width, and the third opening width serving as a width at a boundary portion between the buried insulating layer and first semiconductor layer, and a connection portion electrically connected to the second capacitor electrode.

REFERENCES:
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patent: 5075248 (1991-12-01), Yoon et al.
patent: 5309008 (1994-05-01), Watanabe
patent: 5363327 (1994-11-01), Henkles et al.
patent: 5571743 (1996-11-01), Henkels et al.
patent: 5618751 (1997-04-01), Golden et al.
patent: 5770484 (1998-06-01), Kleinhenz
patent: 6001684 (1999-12-01), Shen
patent: 6472702 (2002-10-01), Shen

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