Semiconductor memory device with buried layer under groove capac

Static information storage and retrieval – Magnetic bubbles – Guide structure

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 2312, 357 41, 357 55, 365149, H01L 2978

Patent

active

047928344

ABSTRACT:
Disclosed is a semiconductor memory device which has a transfer transistor of a MOS structure on a surface of a semiconductor body, and a trenched capacitor having a groove which is formed so as to extend from a surface of the semiconductor body to a certain depth thereof and an electrode which is formed from a bottom portion of the groove to at least a level above an opening of the groove, the source region of the transfer transistor being connected to the electrode of the trenched capacitor and the drain region thereof being connected to a bit line.

REFERENCES:
patent: 4116720 (1978-09-01), Vinson
patent: 4364074 (1982-12-01), Garnache et al.
patent: 4432006 (1984-02-01), Takei
Sunami et al., "A corrugated Capacitor Cell (CCC) for Megabit Dynamic MOS Memories," IEDM Dig. Tech. Papers, pp. 806-808, Dec. 1982.
Mano et al., "Submicron VLSI Memory Circuits," IEEE International Solid-State Circuits Conference, LSSCC Dig. Tech. Papers, pp. 234-235, Feb. 1983.
Minegishi et al., "A Submicron CMOS Megabit Level Dynamic RAM Technology Using Doped Face Trench Capacitor Cell," LEDM Dig. Tech. Papers, pp. 319-322. Dec. 5-7, 1983.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor memory device with buried layer under groove capac does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor memory device with buried layer under groove capac, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor memory device with buried layer under groove capac will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1912143

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.