Semiconductor memory device having variable resistance...

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction

Reexamination Certificate

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C257SE45003, C365S148000

Reexamination Certificate

active

08049204

ABSTRACT:
A semiconductor memory device includes a variable resistance element including a first electrode, a current path forming region, and a second electrode. The current path forming region includes a first region made of a variable resistance material whose resistivity changes by applying voltage, and a second region formed by doping a metal element to the variable resistance material such that a resistivity of the second region is higher than that of the first region and is not changed by applying a voltage used to change the resistivity of the first region. The first region is in contact with the first electrode and the second electrode, and extends from one electrode side to the other electrode side. The second region is provided outside the first region in at least part of the current path forming region in direction extending from one electrode side to the other electrode side.

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J. F. Gibbons et al., “Switching Properties of Thin NiO Films”, Solid-State Electronics Pergamon Press 1964, vol. 7, p. 785-797, 1964.

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