Static information storage and retrieval – Addressing – Particular decoder or driver circuit
Reexamination Certificate
2002-12-27
2003-09-02
Ho, Hoai (Department: 2818)
Static information storage and retrieval
Addressing
Particular decoder or driver circuit
C365S189110
Reexamination Certificate
active
06614712
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention generally relates to semiconductor memory devices, and more particularly, to a semiconductor memory device equipped with an isolation signal generating circuit for controlling electrical isolation between a cell array and a sense amplifier. The present invention is also concerned with a semiconductor memory device of a hierarchical arrangement of word drivers for driving word lines.
2. Description of the Related Art
First, a first conventional semiconductor memory device will be described with reference to 
FIGS. 1 and 2
.
FIG. 1
 is a circuit diagram of a part of a DRAM (Dynamic Random Access Memory), which is the first conventional semiconductor memory device. The DRAM shown in 
FIG. 1
 employs a shared sense amplifier formation in which a sense amplifier is shared by neighboring cell arrays. The DRAM also employs a hierarchical arrangement of word drivers so that each word driver includes a main word driver and a sub word driver.
The DRAM includes cell arrays 
1
-
9
, main word drivers 
10
-
12
, and sub word drivers 
13
-
24
. The main word drivers 
10
-
12
 drive main word lines. The sub word drivers receive output signals of the main word drivers 
10
-
12
 and sub word selection signals that are output by a sub word selection signal generating circuit (not illustrated for the sake of simplicity), and select involved memory cells.
Column decoders 
25
-
27
 decode a column address signal and select columns based on decoding. Sense amplifier parts 
28
-
39
 are shared by neighboring cell arrays in a wiring direction of bit lines, and include a sense amplifier and a bit line precharge circuit.
The DRAM includes row block selecting signal lines 
40
-
45
, and a timing signal line 
46
. The DRAM includes isolation signal generating circuits 
47
-
52
, which receive the row block selecting signals and a timing signal, and thus generate isolation signals for controlling electrical connection/disconnection between the neighboring cell arrays and the sense amplifier parts in the direction in which the bit lines run.
The DRAM includes isolation signal lines 
53
-
58
, and isolation circuits 
59
-
76
. The isolation signal lines 
53
-
58
 carry isolation signals respectively output by the isolation signal generating circuits 
47
-
52
. The isolation circuits 
59
-
76
 respectively have, as switching elements, isolation transistors, which are turned ON/OFF by the isolation signals in order to control electrical connection and disconnection between the cell arrays and sense amplifiers which are adjacent in the direction in which the bit lines run.
In the DRAM thus configured, a read/write operation enables the cell arrays connected to selected main word lines, sub word drivers and sense amplifier parts associated with the selected main word lines. Further, the isolation transistors of the isolation circuits involved in the above read/write operation.
FIG. 2
 is a circuit diagram illustrating an isolation operation performed in the DRAM that is described as the first conventional semiconductor memory device in the present specification. For example, when the word lines driven by the main word driver 
11
 are selected, the cell arrays 
4
-
6
, the sub word drivers 
17
-
20
, and the sense amplifier parts 
31
-
36
 are enabled within the circuit part shown in 
FIG. 2
, while the isolation transistors of the isolation circuits 
62
-
64
 and 
71
-
73
 are turned OFF. The isolation transistors of the isolation circuits 
59
-
61
, 
65
-
70
, and 
74
-
76
 are maintained in the ON state.
Thus, electrical connections are made between the cell array 
4
 and the sense amplifier parts 
31
 and 
34
, between the cell array 
5
 and the sense amplifier parts 
32
 and 
35
, and between the cell array 
6
 and the sense amplifier parts 
33
 and 
36
. In contrast, the cell arrays 
1
, 
2
, 
3
, 
7
, 
8
 and 
9
 are respectively disconnected from the sense amplifier parts 
31
, 
32
, 
33
, 
34
, 
35
 and 
36
.
A description will be given, with reference to 
FIGS. 3 through 5
, of a second conventional DRAM, which employs the shared amplifier formation. The DRAM also employs a hierarchical arrangement of word drivers so that each word driver includes a main word driver and a sub word driver. Further, each isolation signal generating circuit is hierarchically arranged so as to include a main isolation signal generating circuit and a sub isolation signal generating circuit.
Referring to 
FIG. 3
, the second conventional DRAM includes row block selection signal lines 
77
-
82
, a timing signal line 
83
, main isolation signal generating circuits 
84
-
89
, and main isolation signal lines 
90
-
95
. The main isolation signal generating circuits 
84
-
89
 receive the row block selection signal lines 
77
-
82
 and a timing signal carried over the timing signal line 
83
, and generate resultant main isolation signals, which are transferred over the main isolation signal lines 
90
-
95
.
The second conventional DRAM includes column block selection signal lines 
96
-
101
, sub isolation signal generating circuits 
102
-
137
, and sub isolation signal lines 
138
-
155
. The sub isolation signal generating circuits 
102
-
137
 receive the main isolation signals and column block selection signals carried over the column block selection signal lines 
96
-
101
, and generate resultant sub isolation signals, which are transferred over the sub isolation signal lines 
138
-
155
.
The second conventional DRAM includes sub word drivers 
156
-
173
, and has the same cell arrays 
1
-
9
, main word drivers 
10
-
12
, column decoders 
25
-
27
, the sense amplifier parts 
28
-
39
, and isolation circuits 
59
-
76
 as those of the first conventional DRAM.
In the second conventional DRAM, a read/write operation enables the cell arrays connected to selected main word lines, sub word drivers and sense amplifier parts associated with the selected main word lines. Further, the isolation transistors of the isolation circuits involved in the above read/write operation.
FIG. 4
 is a circuit diagram illustrating an isolation operation performed in the second conventional. For example, when memory cells in the cell array 
5
 are selected, the cell array 
5
, the sub word drivers 
164
 and 
165
, the sub isolation signal generating circuits 
110
, 
111
, 
128
 and 
129
, and the sense amplifier parts 
32
 and 
35
 are enabled within the circuit part shown in FIG. 
4
.
Thus, the isolation transistors of the isolation circuits 
63
 and 
72
 are turned OFF, while those of the isolation circuits 
59
-
62
, 
64
-
71
, and 
73
-
76
 are maintained in the ON state. Thus, connections of the cell array 
5
 with the sense amplifier parts 
32
 and 
35
 are made, while the cell arrays 
2
 and 
8
 are disconnected from the sense amplifier parts 
32
 and 
35
, respectively.
FIG. 5
 is a circuit diagram of a configuration of the main isolation signal generating circuits and the sub isolation signal generating circuits employed in the second conventional DRAM. A main isolation signal generating circuit 
174
 includes a NAND circuit 
175
, an inverter 
176
, PMOS (P-channel Metal Oxide Semiconductor) transistors 
177
-
179
, and NMOS (N-channel MOS) transistors 
180
-
182
.
A sub isolation signal generating circuit 
183
 includes PMOS transistors 
184
-
187
, and NMOS transistors 
188
-
191
. A symbol VPP denotes a boosted voltage obtained by boosting a power supply voltage supplied from the outside of the DRAM. A symbol VSS denotes a ground potential.
A description will be given, with reference to 
FIGS. 6 through 8
, of a third conventional DRAM.
FIG. 6
 illustrates a layout of a core part of the third conventional DRAM, which employs the shared sense amplifier formation and the hierarchical arrangements of the word drivers and isolation signal generating circuits. Further, the third conventional DRAM includes a hierarchical arrangement of sub word selection signal generating circuits (¼ signal generating circuits) so that each of the circuits is made up of a main sub-word
Fujioka Shin-ya
Hara Kota
Uchida Toshiya
Fujitsu Limited
Ho Hoai
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