Semiconductor memory device

Details Semiconductor memory device Semiconductor memory device

1998-12-17

2002-12-10

Donels, Jeffrey (Department: 2837)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C439S928100

Reexamination Certificate

active

06493219

ABSTRACT:

BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor memory device which can be exchanged with a variety of models of hard disk devices used with electronic equipment.
Personal computers and other devices requiring large capacity non-volatile storage have traditionally incorporated internal hard disks in their architecture. As shown in
FIG. 8
, a conventional hard disk device
41
is generally mounted to a base
43
inside a personal computer (not shown). A plurality of mounting screw holes
45
a
-
45
d
are formed on a case
44
of hard disk device
41
. Base
43
has a plurality of screw passage holes
46
a
-
46
d
which align with each mounting screw hole
45
a
-
45
d
. A plurality of screws
42
pass through the aligned screw holes to mount hard disk device
41
to base
43
inside the computer.
The prior art includes a disk (not shown) inside internal hard disk device
41
. The disk spins at a high rotation rate. The disk is subject to vibration as a result of the high rate of rotation. These vibrations can damage the disk or cause impact between the disk surface and the read/write head(s) which access disk data.
In operating conditions where external vibrations or impacts are likely to occur such as, for example, in portable computers, the stress on the disk is exacerbated. In these types of environments, hard disk device
41
may be replaced with a semiconductor disk device
48
to reduce the number of moving parts which may be adversely affected by vibration or impact.
Semiconductor disk device
48
also serves as a replacement for hard disk device
41
for upgrade purposes. Hard disk device
41
can also be replaced by semiconductor disk device
48
during normal preventative maintenance program, or if hard disk device
41
fails.
Replacement of hard disk device
41
is accomplished by first removing screws
42
and hard disk device
41
. Semiconductor disk device
48
is attached to base
43
with screws
42
which pass through corresponding mounting screw holes
49
a
-
49
d.
In the above described prior art the position and screw thread size and type of mounting screw holes
45
a
-
45
d
change with different models of hard disk device
41
. The position of screw passage holes
46
a
-
46
d
and the spacing W also differs depending on the model of hard disk device
41
. The spacing and hole pattern to mount semiconductor disk device
48
must correspond to each replaced model of hard disk device
41
. A plurality of types of semiconductor disk devices
48
must therefore be prepared to match various spacing W, screw thread size and type and position for mounting screw holes
45
a
-
45
d
corresponding to various models of hard disk device
41
. If only one type of semiconductor disk device
48
is manufactured, replacement of hard disk device
41
is limited to one type. The position of mounting screw holes
49
a
-
49
d
do not correspond to screw passage holes
46
a
-
46
d
of base
43
when semiconductor disk device
48
is to be exchanged with hard disk device
41
of a differing model. Furthermore, when the screw thread size and type differ, semiconductor disk device
48
can not be mounted and attached to base
43
using screws
42
.
OBJECTS AND SUMMARY OF THE INVENTION
An object of the present invention is to provide a technique for mounting a semiconductor memory device which overcomes the above discussed problems in the prior art.
Another object of the present invention is to provide the facility to exchange one type of semiconductor memory device with a plurality of models of hard disk devices.
Still another object of the present invention is to provide a semiconductor memory device as a non-volatile memory that can be easily mounted in a variety of electronic equipment.
It is still another object of the present invention to provide a semiconductor memory device which can be quickly and easily installed as a replacement for a hard disk device.
Yet another object of the present invention is to avoid the need of additional mounting equipment to adapt the semiconductor memory device to the mounting configuration of various hard disk device types.
Briefly stated, the present invention provides a single semiconductor memory device replaces a variety of hard disk device types having different mounting configurations. The semiconductor memory device must have available the same mounting configuration as that of the hard disk device. Including multiple mounting configuration means, such as screw holes, in the case of the semiconductor memory device avoids the need for multiple replacement semiconductor memory device types. The multiple mounting configurations allow the semiconductor memory device to be mounted in a variety of orientations and mounting configurations. Thus, a single semiconductor memory device type can replace multiple varieties of hard disk device types without the need for extra mounting equipment.
According to an embodiment of the present invention there is provided a semiconductor memory device comprising: a case, the case having at least first and second mounting means, the at least first mounting means includes a plurality of first mounting portions having a first inter-portion spacing in the case, the at least second mounting means includes a plurality of second mounting portions having a second inter-portion spacing in the case, an electronic device being capable of using a hard disk device for memory storage, the hard disk device being removably mounted to a plurality of third mounting portions of the electronic device, and at least one of the at least first and second mounting means aligned with the third mounting portions, whereby the semiconductor memory device is mounted to the electronic device in place of the hard disk device.
According to another embodiment of the present invention there is provided a semiconductor memory device comprising: a case, the case having at least first, second, third and fourth mounting means, both of the first and second mounting means being accessible from at least one of a front and a back of the semiconductor memory device, both of the third and forth mounting means being accessible from a left side and a right side of the semiconductor device, the at least first mounting means includes a plurality of first mounting portions having a first inter-portion spacing in the case, the at least second mounting means includes a plurality of second mounting portions having a second inter-portion spacing in the case, the at least third mounting means includes a plurality of third mounting portions having a third inter-portion spacing in the case, the at least fourth mounting means includes a plurality of fourth mounting portions having a fourth inter-portion spacing in the case, an electronic device being capable of using a hard disk device for memory storage, the hard disk device being removably mounted to a plurality of fifth mounting portions of the electronic device, and at least one of the at least first, second, third and fourth mounting means align with the plurality of fifth mounting portions, whereby the semiconductor memory device is mounted to the electronic device in place of the hard disk device.
According to another aspect of the present invention there is provided a method of replacing a variety of hard disk devices in different electronic devices with a single semiconductor memory device comprising: the electronic devices having a plurality of hard disk device mounting means including first attachment means that mount the hard disk device to the electronic equipment, removing the first attachment means, removing the hard disk device from the electronic device, the semiconductor memory device having at least two sets of pluralities of mounting means, orienting the semiconductor memory device such that at least one of the at least two sets aligns with corresponding hard disk device mounting means in the electronic device, and fixing the semiconductor memory device to the electronic device with at least one of the first attachment means and a second attachment means engaging

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