Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2011-02-01
2011-02-01
Tran, Thien F (Department: 2895)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S784000, C257SE23141
Reexamination Certificate
active
07880312
ABSTRACT:
A plurality of semiconductor memory chips are stacked on a first main surface of a wiring board, and an interposer chip is stacked on the plurality of semiconductor chips, and a semiconductor controller chip is stacked on the interposer chip. The plurality of semiconductor memory chips are independently and electrically connected with inner connecting terminals formed on the wiring board, respectively, and independently controlled by the semiconductor controller chip which is electrically connected with another inner connecting terminals formed on the wiring board via the interposer chip.
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Kabushiki Kaisha Toshiba
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Tran Thien F
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