Semiconductor memory cell capacitor and method for making the sa

Fishing – trapping – and vermin destroying

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437 47, 437 48, 357 236, H01L 21265, H01L 2996

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048596159

ABSTRACT:
A semiconductor memory device includes a trench formed along the circumference of a planar type memory capacitor, a gate insulating film and a memory cell plate being formed on the side wall of the trench, whereby the side wall of the trench is also used as a memory capacitor.
At the bottom of the trench, a thick insulating film is formed to be a cell separating region.

REFERENCES:
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patent: 4353086 (1982-10-01), Jaccodine et al.
patent: 4493740 (1985-06-01), Icomeda
patent: 4523369 (1985-06-01), Nagakubo
patent: 4570325 (1986-02-01), Higuchi
Furyama, "A Vertical Capacitor Cell for ULSI DRAM's" 1984 Symp. on ULSI Technology, Digest of Technical Papers' 10-12 Sep. 1984, San Diego pp. 16-17.
El-Kareh, "Trench Mode One-Device Memory Cell Process" IBM TDB, vol. 26, No. 9, Feb. 84. pp. 4699-4701.
Silverman, "Doped Trench Isolation Process," IBM TDB. vol. 25, No. 6 Nov. 82. pp. 3105-3106.
Wada et al., "A Folded Capacitor Cell (F.C.C.) for Future Megabit DRAM's" IEDM 1984 pp. 244-247.
Barsom "Dynamic DMOS Random-Access Memory Cell Design with Trench" IBM TDB, vol. 21, No. 7, Dec. 78 pp. 2755-2756.
Forger et al., "Improved V-Groove Technology" IBM TDB, vol. 22 No. 11 Apr. 80, p. 4886.
"Cell Structures For Future DRAM's", H. Sunami, Technical Digest of IEDM 1985, pp. 694-697.

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