Semiconductor device manufacturing: process – Semiconductor substrate dicing – By electromagnetic irradiation
Reexamination Certificate
2011-04-19
2011-04-19
Estrada, Michele (Department: 2823)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
By electromagnetic irradiation
C438S403000, C438S406000, C438S407000, C438S458000, C438S464000, C438S520000, C438S528000, C257SE21568
Reexamination Certificate
active
07927975
ABSTRACT:
Electronic apparatus, systems, and methods include a semiconductor layer bonded to a bulk region of a wafer or a substrate, in which the semiconductor layer can be bonded to the bulk region using electromagnetic radiation. Additional apparatus, systems, and methods are disclosed.
REFERENCES:
patent: 5091331 (1992-02-01), Delgado et al.
patent: 5102821 (1992-04-01), Moslehi
patent: 5131968 (1992-07-01), Wells et al.
patent: H1137 (1993-02-01), Easter et al.
patent: 5183769 (1993-02-01), Rutter et al.
patent: H1174 (1993-04-01), Easter et al.
patent: 5213986 (1993-05-01), Pinker et al.
patent: 5236118 (1993-08-01), Bower et al.
patent: 5283107 (1994-02-01), Bayer et al.
patent: 5349207 (1994-09-01), Malhi
patent: 5355022 (1994-10-01), Sugahara
patent: 5413952 (1995-05-01), Pages et al.
patent: 5427638 (1995-06-01), Goetz et al.
patent: 5441911 (1995-08-01), Malhi
patent: 5503704 (1996-04-01), Bower et al.
patent: 5504376 (1996-04-01), Sugahara et al.
patent: 5746883 (1998-05-01), Cha et al.
patent: 5783022 (1998-07-01), Cha et al.
patent: 5804494 (1998-09-01), Mitani et al.
patent: 5818631 (1998-10-01), Askinazi et al.
patent: 5863375 (1999-01-01), Cha et al.
patent: 5945012 (1999-08-01), Chan
patent: 5953620 (1999-09-01), Katou et al.
patent: 5985742 (1999-11-01), Henley et al.
patent: 5994207 (1999-11-01), Henley
patent: 6004866 (1999-12-01), Nakano et al.
patent: 6010579 (2000-01-01), Henley et al.
patent: 6013563 (2000-01-01), Henley et al.
patent: 6013567 (2000-01-01), Henley et al.
patent: 6020252 (2000-02-01), Aspar et al.
patent: 6033974 (2000-03-01), Henley et al.
patent: 6048411 (2000-04-01), Henley et al.
patent: 6051073 (2000-04-01), Chu et al.
patent: 6083324 (2000-07-01), Henley et al.
patent: 6103597 (2000-08-01), Aspar et al.
patent: 6103599 (2000-08-01), Henley et al.
patent: 6110802 (2000-08-01), Aspar et al.
patent: 6113735 (2000-09-01), Chu et al.
patent: 6120660 (2000-09-01), Chu et al.
patent: 6146979 (2000-11-01), Henley et al.
patent: 6153524 (2000-11-01), Henley et al.
patent: 6155909 (2000-12-01), Henley et al.
patent: 6156621 (2000-12-01), Nance et al.
patent: 6159824 (2000-12-01), Henley et al.
patent: 6159825 (2000-12-01), Henley et al.
patent: 6162705 (2000-12-01), Henley et al.
patent: 6171965 (2001-01-01), Kang et al.
patent: 6180496 (2001-01-01), Farrens et al.
patent: 6184111 (2001-02-01), Henley et al.
patent: 6186091 (2001-02-01), Chu
patent: 6187110 (2001-02-01), Henley et al.
patent: 6190998 (2001-02-01), Bruel et al.
patent: 6197695 (2001-03-01), Joly et al.
patent: 6204079 (2001-03-01), Aspar et al.
patent: 6204151 (2001-03-01), Malik et al.
patent: 6207005 (2001-03-01), Henley et al.
patent: 6213050 (2001-04-01), Liu et al.
patent: 6217724 (2001-04-01), Chu et al.
patent: 6221740 (2001-04-01), Bryan et al.
patent: 6221774 (2001-04-01), Malik
patent: 6225192 (2001-05-01), Aspar et al.
patent: 6228176 (2001-05-01), Chu et al.
patent: 6245161 (2001-06-01), Henley et al.
patent: 6248649 (2001-06-01), Henley et al.
patent: 6263941 (2001-07-01), Bryan et al.
patent: 6265328 (2001-07-01), Henley et al.
patent: 6269765 (2001-08-01), Chu et al.
patent: 6274459 (2001-08-01), Chan
patent: 6284631 (2001-09-01), Henley, Jr. et al.
patent: 6287941 (2001-09-01), Kang et al.
patent: 6290804 (2001-09-01), Henley et al.
patent: 6291313 (2001-09-01), Henley et al.
patent: 6291314 (2001-09-01), Henley et al.
patent: 6291326 (2001-09-01), Henley et al.
patent: 6294814 (2001-09-01), Henley et al.
patent: 6300227 (2001-10-01), Liu et al.
patent: 6303468 (2001-10-01), Aspar et al.
patent: 6316333 (2001-11-01), Bruel et al.
patent: 6321134 (2001-11-01), Henley et al.
patent: 6335258 (2002-01-01), Aspar et al.
patent: 6335264 (2002-01-01), Henley et al.
patent: 6338313 (2002-01-01), Chan
patent: 6362077 (2002-03-01), Aspar et al.
patent: 6383890 (2002-05-01), Takisawa et al.
patent: 6391740 (2002-05-01), Cheung et al.
patent: 6403450 (2002-06-01), Maleville et al.
patent: 6423613 (2002-07-01), Geusic
patent: 6429094 (2002-08-01), Maleville et al.
patent: 6448152 (2002-09-01), Henley et al.
patent: 6455399 (2002-09-01), Malik et al.
patent: 6458672 (2002-10-01), Henley et al.
patent: 6458723 (2002-10-01), Henley et al.
patent: 6465327 (2002-10-01), Aspar et al.
patent: 6468879 (2002-10-01), Lamure et al.
patent: 6486041 (2002-11-01), Henley et al.
patent: 6500268 (2002-12-01), Henley
patent: 6500732 (2002-12-01), Henley et al.
patent: 6511899 (2003-01-01), Henley et al.
patent: 6513564 (2003-02-01), Bryan et al.
patent: 6514838 (2003-02-01), Chan
patent: 6528391 (2003-03-01), Henley et al.
patent: 6534381 (2003-03-01), Cheung et al.
patent: 6544837 (2003-04-01), Divakauni et al.
patent: 6544862 (2003-04-01), Bryan
patent: 6548382 (2003-04-01), Henley et al.
patent: 6554046 (2003-04-01), Bryan et al.
patent: 6558802 (2003-05-01), Henley et al.
patent: 6582999 (2003-06-01), Henley et al.
patent: 6590258 (2003-07-01), Divakauni et al.
patent: 6593036 (2003-07-01), Robic et al.
patent: 6596610 (2003-07-01), Kuwabara et al.
patent: 6616854 (2003-09-01), Jones et al.
patent: 6630713 (2003-10-01), Geusic
patent: 6632324 (2003-10-01), Chan
patent: 6632724 (2003-10-01), Henley et al.
patent: 6645828 (2003-11-01), Farrens et al.
patent: 6684889 (2004-02-01), Cavazza
patent: 6720640 (2004-04-01), Kuwabara et al.
patent: 6756285 (2004-06-01), Moriceau et al.
patent: 6756286 (2004-06-01), Moriceau et al.
patent: 6780759 (2004-08-01), Farrens et al.
patent: 6787885 (2004-09-01), Esser et al.
patent: 6790747 (2004-09-01), Henley et al.
patent: 6794276 (2004-09-01), Letertre et al.
patent: 6806171 (2004-10-01), Ulyashin et al.
patent: 6808967 (2004-10-01), Aspar et al.
patent: 6809009 (2004-10-01), Aspar et al.
patent: 6809044 (2004-10-01), Aspar et al.
patent: 6815309 (2004-11-01), Letertre et al.
patent: 6821376 (2004-11-01), Rayssac et al.
patent: 6828216 (2004-12-01), Schwarzenbach et al.
patent: 6829988 (2004-12-01), George et al.
patent: 6830985 (2004-12-01), Oi
patent: 6833314 (2004-12-01), Maleville et al.
patent: 6853414 (2005-02-01), Aspar et al.
patent: 6853802 (2005-02-01), Neyret et al.
patent: 6855619 (2005-02-01), Iwasaki et al.
patent: 6864155 (2005-03-01), Wang
patent: 6867067 (2005-03-01), Ghyselen et al.
patent: 6881596 (2005-04-01), Maleville et al.
patent: 6881644 (2005-04-01), Malik et al.
patent: 6884694 (2005-04-01), Park et al.
patent: 6884697 (2005-04-01), Schwarzenbach et al.
patent: 6890838 (2005-05-01), Henley et al.
patent: 6903032 (2005-06-01), Maleville et al.
patent: 6908027 (2005-06-01), Tolchinsky
patent: 6908774 (2005-06-01), Ghyselen et al.
patent: 6908828 (2005-06-01), Letertre et al.
patent: 6908832 (2005-06-01), Farrens et al.
patent: 6909445 (2005-06-01), Baleras
patent: 6911379 (2005-06-01), Yeo et al.
patent: 6913971 (2005-07-01), Aspar et al.
patent: 6936523 (2005-08-01), Berne et al.
patent: 6939782 (2005-09-01), Aspar et al.
patent: 6939783 (2005-09-01), Neyret et al.
patent: 6941795 (2005-09-01), Maleville
patent: 6942750 (2005-09-01), Chou et al.
patent: 6946365 (2005-09-01), Aspar et al.
patent: 6955971 (2005-10-01), Ghyselen et al.
patent: 6958284 (2005-10-01), Ghyselen
patent: 6959863 (2005-11-01), Figuet et al.
patent: 6969668 (2005-11-01), Kang et al.
patent: 6974757 (2005-12-01), Wang
patent: 6974759 (2005-12-01), Moriceau et al.
patent: 6975016 (2005-12-01), Kellar et al.
patent: 6984570 (2006-01-01), Wang
patent: 6987051 (2006-01-01), Schwarzenbach et al.
patent: 6989314 (2006-01-01), Rayssac et al.
patent: 7008857 (2006-03-01), Ghyselen et al.
patent: 7017637 (2006-03-01), Ueyama et al.
patent: 7022586 (2006-04-01), Maleville et al.
patent: 7029548 (2006-04-01), Aspar et al.
patent: 7033905 (2006-04-01), Ghyselen et al.
patent: 7037804 (2006-05-01), Kellar et al.
patent: 7045878 (2006-05-01), Faris
patent: 7048867 (2006-05-01), Maleville
patent: 7049250 (2006-05-01), Neyret et al.
patent: 7056808 (2006-06-01), Henley et al.
patent: 7056809 (2006-06-01), Rayssac
patent: 7060590 (2006-06-01), Bressot et al.
patent: 7067396 (2006-06-01), Aspar et al.
patent: 7071029 (2006-07-01), Ghyselen et al.
patent: 7071077 (2006-07-01), M
Sandhu Gurtej S.
Sinha Nishant
Smythe John
Estrada Michele
Micro)n Technology, Inc.
Schwegman Lundberg & Woessner, P.A.
LandOfFree
Semiconductor material manufacture does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor material manufacture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor material manufacture will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2722848