Semiconductor material contacting member

Details Semiconductor material contacting member Semiconductor material contacting member

1993-06-28

1994-12-13

Hearn, Brian E.

Metal working

Barrier layer or semiconductor device making

414222, 414225, 414935, 414941, B28D 502

Patent

active

053726120

ABSTRACT:
A semiconductor material contacting member which greatly reduces potential for semiconductor material breakage is provided. Preferably, the contacting member is a ceramic cylinder (60) which can be used to brace a semiconductor wafer (14) in a wafer station (2) of a sputtering system. The ceramic cylinder has an annular shoulder at one end (68), with a flat outer surface. The flat outer surface contacts the wafer (14) along a line (74). The line contacting surface (74) distributes pressure and heat across the contacting surface. Additionally, the ceramic cylinder (60) is relatively soft, thus avoiding damaging the semiconductor material.

REFERENCES:
patent: 4915564 (1990-04-01), Eror et al.
patent: 5046909 (1991-09-01), Murdoch
patent: 5061144 (1991-10-01), Akimoto et al.
patent: 5100285 (1991-03-01), Wagner
patent: 5154730 (1992-10-01), Hodos et al.
patent: 5281320 (1994-01-01), Turner et al.
patent: 5288379 (1994-02-01), Namiki et al.

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