Semiconductor manufacturing system with self-diagnosing function

Details Semiconductor manufacturing system with self-diagnosing function Semiconductor manufacturing system with self-diagnosing function

1994-04-25

1996-08-27

Evans, F. L.

Optics: measuring and testing

By alignment in lateral direction

With registration indicia

356375, 25055929, G01B 1100

Patent

active

055506348

ABSTRACT:
A fine alignment section positions a reference wafer for inspecting the accuracy, delivers a cutting table by an interval value between the regular patterns, and a regular pattern position on the reference wafer for inspecting the accuracy is inspected at that time. An inspecting means compares the detected value by the fine alignment section with a true pattern position on the wafer to inspect the positioning accuracy of a semiconductor manufacturing system. Furthermore, the fine alignment section positions the reference wafer for inspecting the accuracy, delivers the cutting table by an interval between irregular pattern, and detects a irregular pattern position of the reference wafer for inspecting the accuracy at that time. The inspecting means compares the detected value detected by the fine alignment section with the true pattern position on the wafer to inspect the mechanical accuracy of the semiconductor manufacturing system.

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