Semiconductor manufacturing process for decreasing the optical r

Fishing – trapping – and vermin destroying

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437245, 437977, 437946, 20419228, 2041923, 156665, H01L 21302

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active

051399741

ABSTRACT:
A semiconductor manufacturing process for increasing the optical absorptivity and decreasing the optical reflectivity of a metal film in order to reduce the effect of reflective notching and widen the process exposure window for photolithographic patterning. A metal film to be photopatterned is first deposited on a substrate and is then roughened to increase the surface area and to provide an irregular surface for reabsorbing scattered light. Surface roughening may be accomplished by dry etching or by simple ion bombardment during a reverse sputtering process. A second metal layer may also be deposited upon the roughened surface by sputter deposition to achieve a desired surface roughness.

REFERENCES:
patent: 3984300 (1976-10-01), Van Ommeren
patent: 4523372 (1985-06-01), Balda et al.
patent: 4933304 (1990-06-01), Chen et al.
Arnold Aronson, "The Art of Sputtering Process Development", Process Equipment Division Materials Research Corporation.
Michael Roche and Manfred Schneegans, "Titanium Nitride for Antireflection Control", J. Vac Sci Technology B 6(4) Jul./Aug. 1988.

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