Semiconductor manufacturing equipment with an open-topped...

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching

Reexamination Certificate

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C257SE21219

Reexamination Certificate

active

07994067

ABSTRACT:
A semiconductor manufacturing apparatus and a semiconductor manufacturing method, and has as one object to process a wafer easily and stably irrespective of thickness. To achieve the above object, a semiconductor manufacturing apparatus includes: an open-topped cassette that encases a semiconductor substrate; a plurality of processors for performing a predetermined processing of the semiconductor substrate; and a transporting mechanism that transports the cassette encasing the semiconductor substrate between the plurality of processors.

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