Semiconductor manufacturing device and semiconductor...

Details Semiconductor manufacturing device and semiconductor... Semiconductor manufacturing device and semiconductor...

2006-11-28

2006-11-28

Patel, Paresh (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S1540PB, C438S014000, C438S128000, C438S129000, C438S130000, C438S131000, C438S132000

Reexamination Certificate

active

07141995

ABSTRACT:
A semiconductor manufacturing device includes a prober whose needles are at once engaged for contacting pads of two chip forming regions within a wafer. In one chip forming region, trimming is performed, while in the other chip forming region, inspecting posterior to trimming is performed.

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ShibaSoku Co., Ltd. “LSI Test Systems Page.” Aug. 16, 2004 <http://www.shibasoku.co.jp/index-e.html>.
GSI Lumonics, Inc. “WaferTrim™ M310 Page”<http://www.gsilumonics.com>, no date.
Tokyo Electron Limited. “Semiconductor Production Equipment Page.” <http://www.tel.com/eng/products/semiproducts.htm>, no date.

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