Semiconductor manufacturing device and method of removing partic

Details Semiconductor manufacturing device and method of removing partic Semiconductor manufacturing device and method of removing partic

1998-02-06

2000-02-15

Stinson, Frankie L.

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

134902, 1341041, 438905, 438906, 156345, B08B 302

Patent

active

060241055

ABSTRACT:
An introduction pipe for gas or the like for introducing water or water vapor is connected to a vacuum process chamber. The vacuum process chamber is evacuated through an evacuation exhaust port, and the introduced water vapor or water is solidified or liquefied by adiabatic expansion using a floating fine particle as a core. The particle on which the water vapor or the like is solidified or liquefied is discharged outside the vacuum process chamber. Thus, a semiconductor manufacturing device capable of reducing the number of fine particles on a wafer without decreasing uptime ratio is achieved.

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