Coating apparatus – Gas or vapor deposition – Multizone chamber
Reexamination Certificate
2011-04-12
2011-04-12
Moore, Karla (Department: 1716)
Coating apparatus
Gas or vapor deposition
Multizone chamber
C118S7230AN, C156S345310
Reexamination Certificate
active
07922819
ABSTRACT:
Reduction in a space of a manufacturing line, improvement of efficiency, improvement of utilization efficiency of materials, additionally, reduction in the manufacturing cost is realized by applying a means for describing a wiring pattern or a resist pattern directly on a substrate, a means for locally performing a vapor phase process such as film formation or etching under atmospheric pressure or adjacent to atmospheric pressure.
REFERENCES:
patent: 4328257 (1982-05-01), Muehlberger et al.
patent: 5429994 (1995-07-01), Ishikawa
patent: 5483082 (1996-01-01), Takizawa et al.
patent: 5549780 (1996-08-01), Koinuma et al.
patent: 5563095 (1996-10-01), Frey
patent: 5580796 (1996-12-01), Takizawa et al.
patent: 5679167 (1997-10-01), Muehlberger
patent: 5824361 (1998-10-01), Asanuma
patent: 6051150 (2000-04-01), Miyakawa
patent: 6203619 (2001-03-01), McMillan
patent: 6429400 (2002-08-01), Sawada et al.
patent: 6660545 (2003-12-01), Furusawa
patent: 6697698 (2004-02-01), Yoshitake et al.
patent: 6801827 (2004-10-01), Yoshitake et al.
patent: 6871943 (2005-03-01), Ogawa
patent: 6909477 (2005-06-01), Yi et al.
patent: 7629033 (2009-12-01), Hongo et al.
patent: 2001/0027013 (2001-10-01), Tsutsui
patent: 2002/0002948 (2002-01-01), Hongo et al.
patent: 2002/0067400 (2002-06-01), Kawase et al.
patent: 2002/0109143 (2002-08-01), Inoue
patent: 2002/0128515 (2002-09-01), Ishida et al.
patent: 2002/0151171 (2002-10-01), Furusawa
patent: 2003/0054653 (2003-03-01), Yamazaki et al.
patent: 2003/0059975 (2003-03-01), Sirringhaus et al.
patent: 2003/0059984 (2003-03-01), Sirringhaus et al.
patent: 2003/0059987 (2003-03-01), Sirringhaus et al.
patent: 2003/0060038 (2003-03-01), Sirringhaus et al.
patent: 2003/0132987 (2003-07-01), Ogawa
patent: 2004/0050685 (2004-03-01), Yara et al.
patent: 2004/0075396 (2004-04-01), Okumura et al.
patent: 2004/0224433 (2004-11-01), Yamazaki et al.
patent: 2004/0253896 (2004-12-01), Yamazaki
patent: 2004/0266073 (2004-12-01), Yamazaki
patent: 2005/0011752 (2005-01-01), Yamazaki et al.
patent: 2005/0013927 (2005-01-01), Yamazaki
patent: 2005/0064091 (2005-03-01), Yamazaki
patent: 2005/0090029 (2005-04-01), Yamazaki et al.
patent: 2005/0167404 (2005-08-01), Yamazaki
patent: 2007/0251453 (2007-11-01), Hongo et al.
patent: 1071117 (2001-01-01), None
patent: 1 340 838 (2003-09-01), None
patent: 06-202153 (1994-07-01), None
patent: 07-024579 (1995-01-01), None
patent: 09-320363 (1997-12-01), None
patent: 10-062814 (1998-03-01), None
patent: 11-340129 (1999-12-01), None
patent: 2000-169977 (2000-06-01), None
patent: 2000-328269 (2000-11-01), None
patent: 2001-068827 (2001-03-01), None
patent: 2001-093871 (2001-04-01), None
patent: 2001-179167 (2001-07-01), None
patent: 2002-066391 (2002-03-01), None
patent: 2002-151478 (2002-05-01), None
patent: 2002-237463 (2002-08-01), None
patent: 2002-237480 (2002-08-01), None
patent: 2002-289864 (2002-10-01), None
patent: 2002-324966 (2002-11-01), None
patent: 2002-359246 (2002-12-01), None
patent: 2002-359347 (2002-12-01), None
patent: 2002-367774 (2002-12-01), None
patent: 2003-017413 (2003-01-01), None
patent: 2003-031477 (2003-01-01), None
patent: 2003-311197 (2003-11-01), None
patent: 2003-347284 (2003-12-01), None
patent: 2001-0093073 (2001-10-01), None
patent: WO-01-47044 (2001-06-01), None
patent: WO 02/40742 (2002-05-01), None
patent: WO-2004/070809 (2004-08-01), None
patent: WO-2004/070810 (2004-08-01), None
patent: WO 2004/070811 (2004-08-01), None
patent: WO-2004/070819 (2004-08-01), None
patent: WO-2004/070820 (2004-08-01), None
patent: WO-2004-070821 (2004-08-01), None
patent: WO-2004-070822 (2004-08-01), None
patent: WO-2004-070823 (2004-08-01), None
International Search Report Dated Apr. 6, 2004 of PCT/JP2004/000932.
International Search Report (Application No. PCT/JP2004/000895) and Written Opinion dated Apr. 27, 2004 with partial translation of Written Opinion.
International Search Report (Application No. PCT/JP2004/000897) and Written Opinion dated Apr. 27, 2004 with partial translation of Written Opinion.
International Search Report (Application No. PCT/JP2004/000899) and Written Opinion dated Apr. 27, 2004 with partial translation of Written Opinion.
International Search Report (Application No. PCT/JP2004/000900) and Written Opinion dated Jun. 1, 2004 with partial translation of Written Opinion.
International Search Report (Application No. PCT/JP2004/000915) and Written Opinion dated Apr. 27, 2004 with partial translation of Written Opinion.
International Search Report (Application No. PCT/JP2004/000918) and Written Opinion dated Apr. 27, 2004 with partial translation of Written Opinion.
International Search Report (Application No. PCT/JP2004/000930) and Written Opinion dated Apr. 13, 2004 with partial translation of Written Opinion.
S. Wolf et al. “Silicon Processing for the VLSI ERA” vol. 1 (Process Technology), pp. 198, 408, 427, 539, 542, 535; Jan. 1, 1986.
International Application No. PCT/JP2004/000932—Written Opinion dated Apr. 6, 2004 with partial translation of Written Opinion.
Korean Office Action (Application No. 2005-7013795; PCTKR06953) Dated Nov. 16, 2010.
Costellia Jeffrey L.
Moore Karla
Nixon & Peabody LLP
Semiconductor Energy Laboratory Co,. Ltd.
LandOfFree
Semiconductor manufacturing device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor manufacturing device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor manufacturing device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2626165