Semiconductor manufacturing apparatus including a temperature co

Details Semiconductor manufacturing apparatus including a temperature co Semiconductor manufacturing apparatus including a temperature co

1989-03-29

1991-07-09

Beck, Shrive

Coating apparatus

Gas or vapor deposition

118666, 118724, 118725, 118728, 4272552, C23C 1600

Patent

active

050295543

ABSTRACT:
A semiconductor manufacturing apparatus includes a furnace having a tubular body with inner and outer tubular members. A boat having wafers mounted thereon is positioned inside the inner tubular member. Temperature control inside the tubular body is provided by a thermocouple device located between the inner and outer tubular members. A mixture of dichlorosilane gas and ammonium gas formed by a mixing nozzle at a temperature which is lower than the temperature in the tubular body is supplied to the wafers from positions juxtaposed with the wafers mounted on the boat.

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patent: 4674434 (1987-06-01), Ishihara
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