Abrading – Machine – Combined
Patent
1998-01-30
2000-10-10
Hardy, David
Abrading
Machine
Combined
257417, 257419, 451 5, B24B 700, B24B 900, H01L 2982
Patent
active
061296139
ABSTRACT:
A pressure sensing structure for measuring a local pressure on a surface of a wafer and a wafer carrier for communicating with the wafer is disclosed. The pressure sensing structure includes a conductive via extending through the wafer, a pressure transducer electrically connected to a first side of the conductive via, and a connector arranged in electrical contact with a second side of the conductive via. Further, a wafer incorporating multiple such pressure sensing structures is disclosed. In addition, a pressure sensing structure further including integrated circuitry in electrical contact with the pressure transducer and a conductive via is disclosed. The pressure sensing structure is well suited for use in sensing pressure variations throughout the surface of the wafer when a selected wafer layer is undergoing a chemical mechanical polishing operation.
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Hardy David
Philips Electronics North America Corp.
Wilson Allan R.
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